Top 5 producenten van blisterverpakkingen 2016-2020

21 oktober 2016

In a new report Technavio has announced the top 5 leading vendors for the global blister packaging market. The top 5 vendors identified are Amcor, Bemis, Owens-Illinois, Sonoco and WestRock.
Players in this market compete on the basis of performance, innovation, product features, quality, cost, and financial stability. The competition is very intense due to the presence of various established players in the market. Vendors are investing in the development of innovative product lines to increase their sales and profitability in the market. The vendors are introducing smart blister packaging that enables companies to track their packages (Persbericht Technavio, 7 oktober 2016).
Klik hier voor het persbericht.
Klik hier voor meer informatie over het rapport.

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